Multilayer PCB

Advantages of Multilayer PCB Technology

A multilayer PCB is a printed circuit board that combines multiple single-layer or double-layer PCBs bonded together with insulating layers and electrically connected between layers via vias. Compared to traditional single-layer or double-layer PCBs, multilayer PCBs offer the following advantages:

• Higher wiring density: The multilayer structure allows for more complex circuit designs within a limited space, meeting the miniaturization and high integration requirements of modern electronic devices.

• Better electrical performance: Multilayer PCBs can optimize signal paths, reduce signal interference, and improve signal integrity and transmission speed.

• Support for complex functions: Multilayer PCBs can integrate more functional modules, supporting the design and manufacture of highly complex electronic devices.

• Lightweight design: Compared to combinations of multiple single-layer PCBs, multilayer PCBs have a more compact structure and are lighter, making them suitable for weight-sensitive applications such as aerospace.

Technical Specifications

Kingfield multilayer PCBs offer superior technical performance, meeting the demands of a wide range of demanding products.

1. Design and Engineering:

PCB design is performed according to customer requirements, including circuit layout, layer stack-up, and impedance control. Advanced EDA software is used for design and simulation to ensure the rationality and reliability of the design.

2. Inner Layer Fabrication:

The designed circuit pattern is transferred onto a copper foil substrate, and the inner layer circuit is fabricated using processes such as photolithography and etching. After the inner layer fabrication is completed, AOI inspection is performed to ensure the accuracy of the circuit pattern.

3. Lamination:

The prepared inner layers, prepreg, and outer copper foil are stacked together according to design requirements and laminated under high temperature and pressure to form a multilayer PCB substrate. Precise control of temperature, pressure, and time is required during lamination to ensure strong adhesion between layers.

4. Drilling:

High-precision CNC drilling machines are used to drill through-holes, blind vias, and buried vias on the laminated substrate. Drilling accuracy directly affects the reliability of interlayer connections. Kingfield employs advanced drilling equipment to ensure hole diameter and position accuracy.

5. Copper plating:

Through chemical and electrolytic copper plating processes, a uniform copper layer is formed on the inner wall of the drilled holes and the surface of the substrate, achieving interlayer electrical connections. The quality of copper plating directly affects the electrical performance and reliability of the PCB.

6. Outer Layer Fabrication:

Similar to the inner layer fabrication, circuit patterns are created on the outer copper foil using processes such as photolithography and etching. After the outer layer fabrication is complete, AOI is performed to ensure the accuracy of the circuit patterns.

7. Solder resist and screen printing:

Solder resist ink is applied to the PCB surface to protect the circuit from external environmental influences. Then, component markings and other information are printed on the PCB surface using a screen printing process.

8. Testing and Inspection:

Completed PCBs undergo comprehensive testing and inspection, including electrical testing, visual inspection, and dimensional measurements. Kingfield employs advanced testing equipment and a rigorous quality control system to ensure that every PCB meets quality standards.

Aerospace:

Used in avionics equipment, satellite communication systems, etc., featuring high reliability and radiation resistance.

Avionics Equipment
Satellite Communication Systems
Navigation Systems

Communication equipment:

Used in communication equipment such as base stations, routers, switches, and optical modules, supporting high-speed signal transmission and complex circuit designs.

5G base stations and equipment
High-speed routers and switches
Optical communication modules

Medical equipment:

Used in medical diagnostic equipment, monitoring equipment, and treatment equipment, characterized by high reliability and stability.

Medical imaging equipment, vital signs monitors, portable medical devices.

Industrial Control:

Applied to industrial automation equipment, PLCs, frequency converters, etc., it features excellent anti-interference capabilities and stability.

Industrial Automation Control Systems
PLC and DCS Systems
Industrial Robots

Consumer electronics:

Used in consumer electronics products such as smartphones, tablets, and laptops, supporting high-density, miniaturized designs.

Smartphones and tablets
Laptops and all-in-one PCs
Smart TVs and set-top boxes

Automotive electronics:

Used in automotive electronic control systems, in-vehicle entertainment systems, ADAS, etc., possessing excellent high-temperature resistance and vibration resistance.

Engine control system
In-vehicle entertainment system
Advanced Driver Assistance Systems (ADAS)